COB Bonding
- Fine pitched ball screw providing XY table
- Auto-Calibration ultrasonic generator
- Bond quality monitoring system
- Dual monitor display
- Digital bond head and rotary work chuck
- Cycle time: 250ms for 2.0mm long wire (1 die)
- Bond angle: 30o
- Wire size: 25.4~50.8µm dia.
- Bond force: 15~150g
- Bond power: ~1W
- Bond placement: ±20.4µm(3σ)